Polyimide-silica hybrid films were prepared from tetraethoxysilane (TEOS) and polyamic acid (PAA) via sol-gel process in the solution of N,N-dimethylacetamide (DMAc). The cryogenic mechanical and electrical properties of polyimide-silica hybrid films were studied taking into account the effects of silica content. The results indicated that the cryogenic modulus increased with the increase of silica content while the tensile strength and failure strain had a maximum value at proper silica contents. Moreover, the tensile strength and modulus of the hybrid films at cryogenic temperature (77 K) were obviously higher than those at room temperature, while the failure strain of the hybrid films was much lower at cryogenic temperature (77 K) than that at room temperature. The mean electrical breakdown strength of the hybrid films was shown to range from 151 to 225 kV/mm at cryogenic temperature (77 K). (c) 2005 Elsevier Ltd. All rights reserved.