Copper and nickel electrodeposition into ordered macropores prepared in p-type silicon has been studied in aqueous solutions containing cupric and nickel ions, respectively. When a macroporous silicon template was cathodically polarized in 0.1 M cupric sulfate solution, copper was deposited preferentially at the pore bottom in the dark, whereas the deposition was found to proceed not only at the pore bottom but also partially on the pore wall under the back side illumination. In contrast, the deposition of nickel in 0.1 M nickel sulfate solution was not possible in the dark, while deposition occurred uniformly on the entire surface of the pore wall under the back side illumination. Dissolution of silicon templates by the alkaline etching process led to the formation of copper microrods and nickel microtubes. The deposition behavior of both metals was compared and this discrepancy was discussed.