화학공학소재연구정보센터
Polymer, Vol.47, No.6, 1785-1795, 2006
Synthesis of novel bisphenol containing phthalazinone and azomethine moieties and thermal properties of cured diamine/bisphenol/DGEBA polymers
A novel bisphenol(1,2-diliydro-2-(4-((4-hydroxy)phenyliminomethylidene)pheiiyl)-4-(4-((4-(4-hydroxy)phenyliminomethylidene)phenoxy)phenyl)(2H)phthalazin -1-one. DPP) and a diamine(1,2-dihydro-2-(4-aminophnyl)-4-(4-(4-ainitiophenox),)phenyl)(2H) phthalazin-1-one. DAP) were synthesized and characterized. The novel epoxy polymers containing phthalazinone and/or azomethine moieties were prepared by binary polymerization of DAP (or DPP) with diglycidyl ether of biplienyl A (DGEBA) and ternary polymerization of hybrid Curing agents, DAP/DPP (DAP and DPP under different molar ratios) with DGEBA. The cure behaviors of these new epoxy systems were studied by dynamic differential scanning calorimeter (DSC) and Infrared (IR) scans. Especially, the activation energy of DAP/DGEBA calculated by Kissinger and Ozawa methods were 73.8 and 77.4 kJ/mol, respectively. For ternary epoxy system, it was found that hybrid curing agents of DAP/DPP exhibited significant associated effect on their reactivity towards the oxirane group. Glass transition temperatures (T-g's) of these new epoxy polymers were all above 150 degrees C from the results of DSC, and the initial thermal decomposition temperatures (T-d.5%'s) and integral procedure decomposition temperatures (IPDT's) of these new epoxy polymers are above 350 and 850 degrees C, respectively from results of thermogravimetric analyses (TGA). These results show that new epoxy polymers containing phthalazinone and/or azomethine moieties exhibited excellent thermal properties. Especially, thermal properties of the ternary epoxy polymers could be modified by changing the content of DAP and DPP. The linear relationships between char yield (Y-c,Y-wt%) and the structural compositions of these new polymers (weight percentage of phthalazinone, azomethine and nitrogen, C/H weight ratio) were built. (c) 2006 Elsevier Ltd. All rights reserved.