Particle-free silicon and nickel thin films were successfully fabricated by laser-ablating a melted section of their target surface, which gives a high evaporation pressure at the melting point. The influence of direct evaporation from a melted target was reduced negligibly by melting the target only locally with a focused electron beam (e-beam) and increasing the laser frequency. The silicon films fabricated by the present method, pulse laser deposition of a partially molten target, were able to firmly adhere to the substrates and withstood steel needle scratching, unlike e-beam-evaporated films. (c) 2005 Elsevier B.V. All rights reserved.