Pb-Free 도금용액 및 피막의 신뢰성평가

허진영; 구석본; 이홍기

Clean Technology, Vol.11, No.3, 153-164, September, 2005

A Reliability Test for Pb-Free Plating Solution and its Deposit

This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free poating Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

Keywords:Pb-Free;Solder plating;Joint;Finishing surface;Reliability;Pb-Free solder

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[1] 조일제, Korea IMS secretariat data (2003)

[2] 김우영, J. Korean welding society, 20(3), 287 (2002)

[3] 이순복, 박태상, Micro-joining & packaging기술 산학연 심포지엄 data (2003)

[4] 송병석, 조재립, J. Korean society for quality management (2004)

[5] 유충식, Samsung electro-mechanics data (2003)

[6] J. electronic Eng., 1, 85 (2001)

[7] 정석원, The korean institute of suface engineering, 36(5), 386 (2003)

[8] 이호영, J. korean institute of surface engineering, 35(4), 1 (2002)

[9] 김형태, Micro-joining & packaging 기술 산학연 심포지엄 data (2004)

[10] 지성근, Ep&C, 10, 144 (2001)

[11] 강경인, Journal of the korean weldign society, 20(3) (2002)

[12] 이순복, EP&C, 2, 38 (2003)

[13] 이창배, Journal of the korean welding society, 20(3), 272 (2002)

[14] 김정관, Journal of the microelectronics & packaing society, 9, 61 (2002)

[15] Bongtae H, Korea electronics show data (2003)

[16] Components materials reliability infrastructure technology diffusion workshop data (2004)

[17] 정석원, Journal of the Microelectronics & packaing society, 10, 39 (2003)

[18] Wu CML, Materials science and engineering, 44, 1 (2004)

[19] 홍원식, Journal of the korean institute of plant engineering, 7(1) (2002)

[20] Lee T, University of california a master's thesis (2001)

[21] Zeng K, Tu KN, Materials science and Engineering, 38, 55 (2002)

[22] Zeng X, Journal of alloys and compounds, 348, 184 (2002)

[23] Lin K, Surface Science, 214, 243 (2003)

[24] 김주연, University of Suwon a master's thesis (2000)

[25] Ma X, Mater. Lett., 57, 3361 (2003)

[26] 윤정원, 정성보, J. Alloy. Compd., 396, 122 (2005)

[27] Yun K, Prospect. Ind. Chem., 3(5), 37 (2000)

[28] Tanaka H, Espec technology report, 12, 17 (2002)

[29] Tanaka H, Espec technology report, 14, 1 (2002)

[30] Yoshihara S, Journal of japanese surface engineering, 49(11) (1998)