We have developed a resist removal process that uses a laser. Laser irradiation far below the ablation threshold was useful to remove a resist that was strongly adhered to the substrate. We used the second harmonics of Nd: YAG (Y3Al5O12) laser pulses (532 nm) to irradiate the polyacrylic-type resist for manufacturing printed circuit boards. At appropriate laser fluence, the resist, which transmits the laser light 80% at 532 nm, was detached from the substrate while retaining its original shape. This technique is not based on laser ablation. Therefore, no damage occurred to the substrate. It was a dry process: it used neither water nor chemicals. Compared to conventional chemical processing, environmental pollution is prevented. Power consumption and running costs can be reduced. (c) 2006 The Electrochemical Society.