Resoles were prepared separately with different phenols, with formaldehyde having phenol-to-formaldehyde mole ratio of 1:2 in basic medium at 70 degrees C. These resoles were physically blended with different weight percentages of diglycidyl ether of bisphenol-A (DGEBA)-epoxy resin. The blends were cured with 40, 50, and 60 wt % polyamide (based on total amount of the blended resin). Decomposition kinetics of blend sample was studied by dynamic thermogravimetric (TG) analysis. It was found that the degradation of most of the blend samples followed two-step second-order degradation kinetics with 50 wt % polyamide and varied reaction orders with 40 and 60 wt % polyamide and type of phenols used in the resole. The energy of activation (E) was found to be maximum with the blend system containing p-cresolic resole and epoxy. The value of preexponential factor (Z) decreased when phenolic resole was changed to p-cresolic resole in the blend. Also, the plotted values of E and Z were found to be in close resemblance with those obtained from calculated values. (c) 2006 Wiley Periodicals, Inc.