Ultra-thinning of Ni paste films for BME-MLCC (Base Metal Electrode Multilayered Ceramic Capacitor) internal electrode was investigated. Adding various dispersants, ball-milling powder, and using the pre-dispersion process to improve Ni paste dispersion and properties of the paste electrodes/thick films, were employed. The paste containing 200 nm sized Ni powders, ethyl cellulose vehicle (eta = 2.98 x 10(4) mPa-s at 0.1 s(-1)), and Emphos PS-21A as a dispersant proved to be the most desirable candidate. This paste thick film showed the smallest surface roughness (R (a) = 0.10 mu m and R (max) = 0.97 mu m) at a viscosity (eta = 2.80 x 10(5) mPa-s at 0.1 s(-1)) adaptable to screen-printing. In addition, the Ni paste/thick film had the low sheet resistivity (rho angstrom= 1.11 x 10(-4) Omega cm) and an excellent microstructure after sintering at 1,290 degrees C for 3 h in a 97% N-2/3% H-2 atmosphere.