In this work, three-dimensional (3D) SU-8 micro- and nanostructures were fabricated using a reversal UV imprint process at low temperature and low pressure. The SU-8 polymer was coated on a patterned glass mold and then transferred onto various substrates by reversal UV imprint at a typical temperature of 50 degrees C, pressure of I MPa, and UV exposure of I s. The lower temperature and pressure used compared to conventional thermal imprint shorten the imprint time and alleviate pattern distortion. A combination of silanes was used to generate a medium surface energy on the imprint molds to enable polymer spin coating and mold release after imprint. In addition, an 02 plasma was used for glass mold treatment to improve uniformity of silane coating and to increase substrate surface energy for better polymer adhesion. Using this technology, 100 nm- 1 mu m wide SU-8 gratings were fabricated on flat or patterned substrates with good fidelity. By repeating this process, multiple-level nanochannels, cavities, or air-bridging polymer structures with 400 nm- 10 mu m widths have been demonstrated. The surface energy of SU-8 was modified using an O-2 plasma to promote layer adhesion for 3D stacking. This reversal UV imprint technology offers versatility and flexibility to stack polymer layers and multiple-level sealed fluidic channels. (c) 2006 American Vacuum Society.