Adhesion properties between a polycarbonate (PC)/acrylonitrile-butadiene-styrene blend substrate and PC films of various thicknesses, bonded through film insert molding, were investigated. The use of various molecular weights of PC and incorporation of PC-oligomer in the blend substrate has been found to severely affect the adhesion strength and alter the delamination characteristics at the film-substrate interface. Thicker films were able to increase film-substrate adhesion, apart from providing added impact resistance to a brittle substrate.