A new chemical vapor deposition (CVD) reactor design was developed to intentionally induce spatially nonuniform film thickness deposition patterns on a single wafer. A segmented showerhead design allows individual regions of a wafer to be exposed to different precursor concentrations simultaneously during a run resulting in different thickness profiles on the wafer and a thickness gradient at the boundaries between segment regions. Different recipes were cycled through each of the segments in a sequence of deposition experiments to develop a model relating precursor concentration to film thickness in each segment region. As a demonstration of spatial programmability, the system was reprogramed using this model to produce uniform thickness amongst the segments; intersegment uniformity approaching 0.60% (thickness standard deviation) was demonstrated. Potential applications of this reactor design to combinatorial CVD are discussed. (c) 2006 American Vacuum Society.