재제조를 위한 제품의 분해성 평가방법의 개발

이화조; 장윤상; Hwa Cho Yi; Yoonsang Chang

Clean Technology, Vol.13, No.2, 134-142, June, 2007

Export Citation

재제조를 위한 제품의 분해성 평가방법의 개발

Development of the Disassemblability Evaluation Methods of the Products for Remanufacturing

이화조, 장윤상^{1, †}

영남대학교 기계공학부, 712-749 경상북도 경산시 대동 214-1
¹수원대학교 기계공학과, 445-743 경기도 화성시 봉담읍 와우리 산 2-2

Hwa Cho Yi, and Yoonsang Chang^{1, †}

School of Mechanical Engineering, Yeungnam University, 214-1 Dae-dong, Kyungsan, Kyungbuk, 712-749, Korea
¹Department of Mechanical Engineering, University of Suwon, San 2-2 Wau-ri, Bongdam-eup, Hwasung City, Kyunggi-do 445-743, Korea

E-mail:

초록

본 연구에서는 재제조를 용이하게 하기 위하여 분해용이성 및 분해시간 산출이라는 두 가지 방법을 이용하여 부품의 분해성 평가 방법을 제시하였다. 또한 부품별 평가로부터 얻어진 분해성 지수로부터 최소 부품수의 개념을 이용하여 제품의 분해성을 도출하는 방법을 개발하였다. 제시된 방법들을 컴퓨터의 외장 케이스에 적용하여 비교 분석하였다. 분해용이성 및 분해시간의 분석에 의한 분해성 평가는 케이스의 일부 분리를 용이하게 한 새 모델이 재제조를 위한 전체 분해시에는 오히려 분해성이 악화된다는 동일한 결론을 보여주었다. 이러한 분해성 평가 방법을 제품의 재제조 및 재활용 특성을 평가하는데 중요한 지표중의 하나로 사용될 수 있을 것이다.

In this study, two methods to evaluate the disassemblability of the parts are proposed, which are constructed from the concepts of ease-of-disassembly and disassembly time. A method to evaluate the disassemblability of the products is consequently developed using the concept of minimum parts. The methods are applied to evaluate the disassemblability of computer cases. The results show the onclusions that the new model has less disassemblability than the old one. These methods are expeted to be used for the evaluation of the possibility of remnufacturing and recycling of a part.

Keywords:재제조;분해성;재활용;분해용이 설계;컴퓨터 케이스

[References]

Kang HY, KNCPC-2004-RE-4 (2004)
Yi HC, J. KSPE, 17(8), 5 (2000)
Joo H, J. KSPE, 16(8), 88 (1999)
Wilder J, Modern Plastics, 67, 16 (1990)
Constance J, Mech. Eng., 114, 60 (1992)
Bakerjian R, Environmentally Responsible Product Design. Design for Manufacturability, Tool and Manuf. Eng. Handbook Series, 4th ed., SME, Dearborn, Michigan, 6, 10.61-10.62 (1992)
Thurston DL, Blair A, IEEE P. Int. Symp. Electron. Environ., 94 (1993)
Eversheim W, Baumann M, Comput. Ind., 17, 287 (1991)
Warmecke HJ, Baessler R, CIRP, 37, 1 (1988)
Boothroyd G, Assembly Automation and Product Design, Marcel Dekker, Inc. (1992)
Akermark AM, 4th Int. Seminar Life Cycle Eng., 327 (1997)
Hanft TA, Kroll E, Design for X, 318 (1996)
Winslow G, Tester S, Coulter S, in Special Publications, SP-1263, Design for Environmentally Safe Automotive Products and Processes, SAE 43-46 (1997)
Nakamura M, Ease-of-Disassembly technology which can simplify product improvement concept, Nikkei Mech (1994)
Boothroyd G, Dewhurst P, Knight W, Product Design for Manufacture and Assembly, Marcel Dekker. Inc. (1994)
Quick JH, Work Factor Time Standards, McGraw-Hill, New York (1962)
Yi HC, Joo HH, Park YC, J. KSPE, 20(5), 232 (2003)

[Referenced By]

[1] Kang HY, KNCPC-2004-RE-4 (2004)

[2] Yi HC, J. KSPE, 17(8), 5 (2000)

[3] Joo H, J. KSPE, 16(8), 88 (1999)

[4] Wilder J, Modern Plastics, 67, 16 (1990)

[5] Constance J, Mech. Eng., 114, 60 (1992)

[6] Bakerjian R, Environmentally Responsible Product Design. Design for Manufacturability, Tool and Manuf. Eng. Handbook Series, 4th ed., SME, Dearborn, Michigan, 6, 10.61-10.62 (1992)

[7] Thurston DL, Blair A, IEEE P. Int. Symp. Electron. Environ., 94 (1993)

[8] Eversheim W, Baumann M, Comput. Ind., 17, 287 (1991)

[9] Warmecke HJ, Baessler R, CIRP, 37, 1 (1988)

[10] Boothroyd G, Assembly Automation and Product Design, Marcel Dekker, Inc. (1992)

[11] Akermark AM, 4th Int. Seminar Life Cycle Eng., 327 (1997)

[12] Hanft TA, Kroll E, Design for X, 318 (1996)

[13] Winslow G, Tester S, Coulter S, in Special Publications, SP-1263, Design for Environmentally Safe Automotive Products and Processes, SAE 43-46 (1997)

[14] Nakamura M, Ease-of-Disassembly technology which can simplify product improvement concept, Nikkei Mech (1994)

[15] Boothroyd G, Dewhurst P, Knight W, Product Design for Manufacture and Assembly, Marcel Dekker. Inc. (1994)

[16] Quick JH, Work Factor Time Standards, McGraw-Hill, New York (1962)

[17] Yi HC, Joo HH, Park YC, J. KSPE, 20(5), 232 (2003)