화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Chemical Engineering Research, Vol.45, No.4, 384-390, August, 2007
Export Citation
PET 필름기재의 구리 무전해도금에 있어서 초임계 CO2 유체가 도금 특성에 미치는 영향
Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate
이희대, 김문선†, 김철경1
  • 성균관대학교 화학공학과, 440-746 경기도 수원시 장안구 천천동 300
  • 1목원대학교 디자인소재학과, 302-318 대전시 서구 목원길 21
Hee-Dai Lee, Moon-Sun Kim†, and Chul kyung Kim1
  • Department of Chemical Engineering, Sungkyunkwan University, 300,Chunchun-dong, Jangan-gu, Suwon 440-746, Korea
  • 1Department of Design & Materials, Mokwon University, 21, Mokwon-gil, Seo-gu, Daejeon 302-318, Korea
E-mail:
초록
본 연구는 CO2 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 25 ℃, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.
In this study, electroless plating of copper was performed on PET film by using the blend of supercritical CO2 and plating solution. The optimum volumetric ratio of supercritical fluid and plating solution was found to be 1:9 and dispersion property was poor at CO2 vol% langer than 10%. Electroless plating of copper was best at 25 ℃ and 15 MPa. Role of added supercritical CO2 is not to increase solubility but to disperse and maintain Cu-particles as the 1st particles.
Keywords:Electroless Plating;Copper Plating;Supercritical Fluid;PET Film
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