Silver nanowires were prepared by polyol process and doped to the system containing conventional micro-scaled sphere or flake silver particles. It is found that the conductance of doped system is much better than the undoped system with the same quantity silver. A plausible mechanism is described as that these nanowires are favor to act as bridges to establish perfect linkage among particles, and the chance of contact and contact area become more than the cases without wires. This development will be meaningful for the preparation of advanced electrically conductive adhesive (ECA) with high conductivity and good adhesive strength.