The effects of slurry chemistry through measured particle aggregate size distribution data were incorporated into the model of chemical mechanical planarization (CMP) of Luo and Dornfeld to predict material removal rate (MRR). This model was able to predict the trends of MRR for copper CMP as observed experimentally from the literature, such as the highest MRR for an alumina slurry with H2O2 in the range of 2-3.6 wt % and 0.1 M glycine. The model was also used to predict MRR for slurries that contained a combination of common additives. (c) 2007 The Electrochemical Study.