Liquid-phase deposition, LPD, method was used for the fabrication of copper ferrite (CuFe2O4) thin film from aqueous solution system of FeOOH-NH4 . HF (aq.) and Cu source (Cu(NO3)(2) or CuCl2) with H3BO3. SEM observation revealed that highly homogeneous thin film was formed on a substrate. In X-ray diffraction measurements, major peaks assigned to CuFe2O4 was observed in heat-treated films. Quantitative analysis of elements in the deposited films indicated the deposition of CuFe2O4. The kinds of Cu-source did not affect on the deposition. Initial content of Cu2+ could alter the Fe/Cu atomic ratio in deposited film.