Wick debinding was investigated as possible means of binder removal for the Mo-Si-B extrudates. With increased temperature the amount of hinder wicked out of the extrudate increased because of a decrease in viscosity, 2513 mPa.s at 75 degrees C down to 7 mPa.s at 250 degrees C. The permeability of the binder in the 1 mu m wicking powder was higher than that in the 0.05 mu m powder, 3.1 x 10(-13) m(2) compared to 6.024 x 10(-15) m(2). The amount of hinder removed at a given temperature was considerably lower, which could be attributed to the larger capillary pressure difference between the 0.05 pm nick and the extrudate (1.55 x 10(5) Pa compared to 1.46 x 10(4) Pa for the 1 mu m powder), Wicking removed approximately 80% of the binder in <10 h at 250 degrees C with no defect formation.