화학공학소재연구정보센터
Journal of Crystal Growth, Vol.300, No.2, 299-307, 2007
Wet KOH etching of freestanding AlN single crystals
We investigated defect- selective wet chemical etching of freestanding aluminum nitride (AlN) single crystals and polished cuts in a molten NaOH-KOH eutectic at temperatures ranging from 240 to 400 degrees C. Due to the strong anisotropy of the AlN wurtzite structure, different AlN faces get etched at very different etching rates. On as-grown rhombohedral and prismatic facets, defect-related etching features could not be traced, as etching these facets was found to mainly emphasize features present already on the un-etched surface. On nitrogen polar basal planes, hexagonal pyramid s/hillocks exceeding 100 mu m in diameter may form within seconds of etching at 240 degrees C. They sometimes are arranged in lines and clusters, thus we attribute them to defects on the surface, presumably originating in the bulk material. On aluminum polar basal planes, the etch pit density which saturates after approx. 2-3 min of total etching time at 350 degrees C equals the density of a certain type of dislocations (presumably screw dislocations) threading the surface. Smaller etch pits form around annealed indentations, in the vicinity of some bigger etch pits after repeated etching, and sometimes also isolated on the surface area. Although alternate explanations exist, we attribute these etch pits to threading mixed and edge dislocations. This paper features etching parameters optimized for different planes and models on the formation of etching features especially on the polar faces. Finally, the issue of reliability and reproducibility of defect detection and evaluation by wet chemical etching is addressed. (c) 2007 Elsevier B.V. All rights reserved.