The CHF3 plasma etched PbZr0.53Ti0.47O3 (PZT) surface was chemically analyzed in order to investigate the dry-etching machining process of PZT thin film. X-ray photoelectron spectroscopy (XPS) results indicated that PbF2, ZrF4, and polymer containing C, H and F formed and remained on the etched surface during the dry-etching process while the Ti was almost completely removed. The removal of the PbF2, was a key issue for getting a high etching rate.