In the design of new high-speed chip generations a huge problem is bleeding off process heat during their operation. The installation of heat sinks onto such chips is necessary. Possible materials are copper-coated carbon composites. They combine high thermal conductivity with low density and a tailorable coefficient of thermal expansion (CTE). The low wettability of copper onto carbon necessitates a surface pretreatment. Flat slices of nitrogen-plasma etched vitreous carbon (Sigradur G) made up as a model system for carbon fiber material. The later serial fabrication of these fibers includes a hot pressing step after the deposition joining them to solid composites. It is simulated by a heat treatment step of the compound. The first sample series consisted of samples with 100 nm molybdenum and 500 nm copper layers (sputter deposited), as deposited and heat treated. The second run concludes samples without molybdenum layer but an additional 50 nm cap layer deposited after heat treatment. All samples were investigated with secondary ion mass spectrometry (SIMS), showing a diffusion of carbon into the molybdenum layer. Measuring MCs+ secondary ions, both matrix elements and trace elements were detectable sufficiently. (c) 2005 Elsevier B.V. All rights reserved.