Direct metal ion beam deposition (DMIBD) technique for Cu thin film metallization is characterized. With suitable operating conditions, secondary Cu- ion yield, ion/atom arrival rate ratio, ion beam energy spreads were optimized at 15%, 0.3, and 10%, respectively. After optimization of DMIBD system, the effect of Cu ion beam energy on the resistivity, adhesion strength, and surface morphology of Cu thin film was investigated. TEM micrograph shows that the film prepared at 75 eV was polycrystalline, while the film prepared at 0 eV was vertical columnar structure. As ion beam energy is increased from 25 to 75 eV, the resistivity is decreased from 6.21 to 2.09 mu Omega cm, while the critical load to cause adhesion failure was increased to about 13 N at 200 eV, which is four-times higher that that of 25 eV. (c) 2006 Elsevier B.V. All rights reserved.