In this paper, a brief review of the fiber-matrix interphase/interface region is given for carbon- and glass-fiber composites. The substructure of the interphase/interface region is discussed in terms of three interphases: (a) the fiber interphase (FI), (b) the sizing interphase (SI), and (c) the matrix interphase (MI), and two interface regions: (a) the FI-SI interface and (b) the SI-MI interface. These substructures are a synthesis of the ideas advanced by Ishida and Koenig and Drzal. The schematic model of interphase deformation behavior originally given by Bascom is reconstructed to include research results from the above researchers. To systematically probe adhesion at the SI-MI interface, functionalized self-assembled monolayers (SAMs) using bonding and non-bonding C-11-type trichlorosilanes are prepared using the research of Menzel and Heise, and that of Cave and Kinloch as a guide. Results from this research are compared with short chain bonding and nonbonding silanes prepared by aqueous and non-aqueous deposition processes. The data were interpreted using the mechanisms proposed by Sharpe, Ishida and Koenig, and Drzal and the mathematical equation proposed by Nardin and Ward. For the non-bonding short-chain silane deposited by aqueous deposition, 90% of the adhesion was found to be due to mechanical interlocking, with the remaining adhesion due to physicochemical interactions. For the bonding short-chain silane deposited by aqueous deposition, the interface strength relative to the non-bonding short-chain silane increased by 31%. However the interfacial shear strength (IFSS) of this system was approximately 40% lower than the comparable bonding SAM interface. This difference was interpreted in terms of the propensity of the C-3-alkylamine to form cyclic ring structures in the MI region as described by Ishida, Koenig, et al. The SAM data also indicates that 70-85% of the maximum IFSS is obtained with 25-50% of the surface covered with functional groups. This suggests that steric hindrance, due to the size of the DGEBA molecules, restricts access to the functional groups on the surface. Therefore, only 35% of the surface functional groups are accessible for bonding in the DGEBA/m-PDA epoxy resin system.