Electrochimica Acta, Vol.42, No.8, 1269-1279, 1997
The Electrodeposition of Platinum Onto a Conducting Ceramic, Ebonex(R)
The deposition of Pt metal onto Ebonex (R) from Pt 5Q electroplating solution at 368 K has been investigated. It has been demonstrated that the nucleation of Pt centres on the as-supplied Ebonex (R) occurred non-uniformly and was a very slow process. This appeared to result from a layer of TiO2 on the surface and without pretreatment of the Ebonex (R), the quality of the deposits was poor. A number of pretreatments were studied. The preferred procedure employed physical abrasion and polishing followed by a chemical etch in aqueous NaF/HCl/CH3COOH and this led to more uniform nucleation as well as good quality Pt deposits which were adherent, coherent and metallic in appearance.