Crystal structure and surface morphology of electroless copper films deposited from solutions containing 2,2’-dipyridyl were investigated by X-ray diffraction and electron microscopic observations. The deposition rate of copper was remarkably affected by bath temperature and 2,2’-dipyridyl concentration. Although Cu2O was codeposited in the copper film prepared at 30 degrees C, pure metallic copper was obtained at 70 degrees C regardless of dissolved O-2. The surface morphology of the copper deposit plated at 30 degrees C exhibited a fine grain structure, while a coarse grain structure was observed for the copper deposit plated at 70 degrees C. Changes in crystal structure and surface morphology of the copper films are discussed as a function of deposition rate.