화학공학소재연구정보센터
Electrochimica Acta, Vol.44, No.17, 2859-2870, 1999
Pulse current plating of TiB2 in molten fluoride
The investigation of TiB2 electrodeposition was carried out using continuous current plating (CCP) and pulse current plating (PCP), electrochemical techniques to produce a uniform and a very low porosity coating. The solvent used is a fluoride mixture (LiF-NaF-KF) with solutes K2TiF6 and KBG(4) in a mass relation of one to four after treatment to remove moisture. The temperature was 600 degrees C and all results were obtained on graphite electrodes as substrate. When necessary, the working electrode potentials were monitored with a Ni/Ni2+//BN reference electrode. The electrodeposition with pulse current plating produces coatings with better quality, showing fewer cracks and better adhesion to the substrate and no anode effect was observed, when compared with those obtained by continuous current plating, for the conditions: frequencies between 5-100 Hz, t(c)/t(off) between 5/1-3/1 or i(c)/i(off) between 1.5 and 1.8.