We report on the operation of an electroplating device based on the uniform injection cell (UIC) concept. Workpiece scale mass transfer characteristics are explored using limiting current measurements and are related to theoretical predictions. Results show that the device delivers predictable and controlled average mass transfer rates at the workpiece length scale. Pattern scale uniformity is explored by electrodeposition of NiFe microgears on to a patterned substrate. Statistical analysis of compositional differences between an electroplated NiFe film and electrodeposited NiFe microgears is used to explore mass transfer on the pattern scale, Results illustrate that the presence of a patterned mold influences the average mass transfer rate compared to the unpatterned electrode, but does not create additional variability in electrolyte mixing across the substrate, Implications for using the device in through-mold plating are discussed and future improvements to the device are suggested.