Copper films have been direct written on heated substrates using both neat metallorganic and two-component, copper nanoparticle/ copper metalloganic inks. Commercial nanoparticle copper (nano-Cu) was characterized by transmission electron microscopy and powder X-ray diffraction (PXRD) and found to consist of Cu/Cu2O spherical particles measuring 100-500 nm in diam. The Cu2O was etched away using an excess of hexafluoroacetylacetone (Hhfa) and vinyltrimethylsilane (VTMS) yielding pure Cu by PXRD. Hhfa etching in the absence of VTMS led to the formation of millimeter-sized Cu particles at room temperature. Neat (hexafluoroacetylacetonato) Cu(I)-(VTMS) (Cu(hfa) VTMS) was spray printed in a nitrogen ambient on glass microscope slides and Kapton at 210-230 degreesC to give dense, adherent films. Hhfa/VTMS-etched nano-Cu was mixed with (Cu(hfa) VTMS) and spray printed in a nitrogen ambient on glass microscope slides and Kapton at 210-220 degreesC. Copper films produced by both approaches were characterized by scanning electron microscopy and standard four-probe resistivity techniques.