Previous Article Next Article Table of Contents Electrochemical and Solid State Letters, Vol.9, No.5, L3-L3, 2006 DOI10.1149/1.2179769 Export Citation Osmium barriers for direct copper electrodeposition in damascene processing (vol 9, pg C41, 2006) Josell D, Witt C, Moffat TP Please enable JavaScript to view the comments powered by Disqus.
