Previous Article Next Article Table of Contents Electrochemical and Solid State Letters, Vol.9, No.5, L5-L5, 2006 DOI10.1149/1.2186340 Export Citation Formation of Cu-Sn alloy layer by contact deposition using quaternary ammonium-imide-type ionic liquid (vol 9, pg C69, 2006) Katase T, Kurosaki R, Murase K, Hirato T, Awakura Y Please enable JavaScript to view the comments powered by Disqus.
