Adsorption studies of polyvinylpyrrolidone (PVP) during potentiostatic copper electrodeposition in the presence of common plating additives are presented. Experiments were conducted using a flow-through microfluidic electrochemical cell. Results show that in the presence of chloride ions, PVP adsorption characteristics are similar to those of polyethylene glycol (PEG), with very fast suppression achieved at PVP concentrations above 200 ppm. In contrast to PEG, PVP inhibits deposition rates even on electrodes in which Cu has been predeposited in the presence of bis(sulfopropyl)disulfide. (c) 2007 The Electrochemical Society.