Solid-State Electronics, Vol.46, No.12, 2269-2272, 2002
Skin effect of on-chip copper interconnects on electromigration
A simple model is derived to evaluate skin effect of on-chip copper interconnects on electromigration. The result gives the range of frequency in which skin effect on electromigration need to be taken into consideration. (C) 2002 Elsevier Science Ltd. All rights reserved.
Keywords:skin effect;copper interconnect;electromigration;reduced vacancy concentration;mean time to failure