An experiment is carried out here to investigate flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip flush-mounted in the bottom of a horizontal rectangular channel. Besides, three different micro-structures of the chip surface are examined, namely, the smooth, pin-finned 200 and pin-finned 100 surfaces. The pin-finned 200 and 100 surfaces, respectively, contain micro-pin-fins of size 200 mu m x 200 mu m x 70 mu m (width x length x height) and 100 mu m x 100 mu m x 70 mu m. The pitch of the fins is equal to the fin width for both surfaces. The effects of the FC-72 mass flux, imposed heat flux, and surface microstructures of the silicon chip on the FC-72 saturated flow boiling characteristics are examined in detail. The experimental data show that an increase in the FC-72 mass flux causes a delay in the boiling incipience. However, the flow boiling heat transfer coefficient is not affected by the coolant mass flux. But adding the micro-pin-fin structures to the chip surfaces can effectively enhance the single-phase convection and flow boiling heat transfer. Moreover, the mean bubble departure diameter and active nucleation site density are reduced for a rise in the FC-72 mass flux. A higher coolant mass flux results in a higher mean bubble departure frequency. Furthermore, larger bubble departure diameter, higher bubble departure frequency, and higher active nucleation site density are observed at a higher imposed heat flux. We also note that adding the micro-pin-fins to the chips decrease the bubble departure diameter and increase the bubble departure frequency. However, the departing bubbles are larger for the pin-finned 100 surface than the pin-finned 200 surface but the bubble departure frequency exhibits an opposite trend. Finally, empirical equations to correlate the present data for the FC-72 single-phase liquid convection and saturated flow boiling heat transfer coefficients and for the bubble characteristics are provided. (c) 2007 Elsevier Ltd. All rights reserved.