Previous Article Next Article Table of Contents Electrochemical and Solid State Letters, Vol.10, No.11, S7-S7, 2007 DOI10.1149/1.2780144 Export Citation Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment (vol 10, pg G76, 2007) Urbanowicz AM, Baklanov MR, Heijlen J, Travaly Y, Cockburn A Please enable JavaScript to view the comments powered by Disqus.
