화학공학소재연구정보센터
Journal of the Electrochemical Society, Vol.154, No.8, D394-D399, 2007
Electroplating of copper-alumina nanocomposite films with an impinging jet electrode
A circular, unsubmerged impinging jet electrode system was developed and used for a systematic investigation of the electrocodeposition of nanocomposite films of copper-alumina over a wide range of process conditions. The process variables investigated were current density of 20-200 mA/cm(2), electrolyte flow rate of 1-7.0 L/min, copper sulfate concentrations of 0.25-1 M with pH of either 0.8 or 1.5, and particle loading from 10 to 160 g/L. Particle incorporation increase linearly with particle loading for all process conditions studied up to a maximum of 6.9 wt %. An average grain size of similar to 175 nm was observed for a deposit formed at 200 mA/cm(2) with 50 nm gamma-Al2O3. (c) 2007 The Electrochemical Society.