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Journal of the Electrochemical Society, Vol.154, No.9, H811-H813, 2007
Al0.22Ga0.78N/GaN HFETs prepared on vicinal-cut sapphire substrates
AlGaN/GaN heterostructure field effect transistors ( HFETs ) were prepared on vicinal-cut sapphire substrates. Under reverse bias, it was found that we can achieve smaller gate leakage current and smaller source-drain leakage current by using the 1 S tilted substrate. These results could be attributed to the better crystal quality and fewer crystal defects by using vicinal-cut sapphire substrates. With 2 mu m gate length, the maximum transconductance, G(m, max), was 110 mS/mm for the HFETs prepared on vicinal-cut sapphire substrates. (c) 2007 The Electrochemical Society.