화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of the Korean Industrial and Engineering Chemistry, Vol.20, No.2, 172-176, April, 2009
Export Citation
구리 표면과 Solder Resist Ink 사이의 밀착력 향상 위한 Soft Etching제 개발을 위한 연구
Study on Soft Etching Material Development to Improve Peel Strength between Surface of Copper and Solder Resist Ink
강윤재, 홍민의1, 김덕현†
  • 한국산업기술대학교 생명화학공학과
  • 1(주)ITMC
Yun-Jae Kang, Min-Eui Hong1, and Duk-Hyun Kim†
  • Department of Chemical Engineering & Biotechnology, Korea polytechnic University, Shihung, Kyonggi 429-793, Korea
  • 1ITMC, InCheon, Kyongg 450-846, Korea
E-mail:
초록
Solder resist ink와 회로표면과의 밀착력 향상을 위해 사용되는 soft etching 제의 기본 조성으로 과산화수소와 황산을 선정하고 inhibitor, 계면활성제, 안정제를 첨가하여 에칭 속도 0.7∼1 μm/min, 표면조도(Ra)값 0.5∼0.6 μm을 만족시키는 soft etching 제 개발을 위한 연구를 하였다. Inhibitor로는 butyl amine, cyclohexyl amine, 5-aminotetrazole (5-Azol)을 첨가하였으며 계면활성제로는 polyethylene glycol (PEG), polyethylene imine (PEI), piperidine을 안정제로는 butyl alcohol, isopropanol, 인산을 첨가하여 각각의 첨가제가 에칭 속도 및 표면조도에 미치는 영향을 비교 분석하였다. 본 연구 결과 과산화수소 3% 황산 4%에 5-Azol 500 ppm, PEI 600 ppm, 인산 10 ppm 첨가 시 0.7∼1 μm/min을 만족시키는 에칭속도와 가장 좋은 표면 조도를 갖는 것을 확인하였으며 solder test 결과 solder resist ink의 들뜸 현상이 발생하지 않는 것을 확인하였다.
In this research, we defined the basic structure of soft etching material as H2SO4/H2O2, and used additives as inhibitor, surfactant, and stabilizer. By analyzing influence to surface roughness and change of etching rate related to type and density of additives, we research to develop soft etching material having the same adhesiveness as existing etching material. As a result of research, it is estimated that after densities of H2O2 and H2SO4 are 3%, 4% respectively, 500 ppm of amine type 5-Azol, as inhibitor, and 600 ppm of PEI, as surfactant, and 10 ppm of phosphoric acid, as stabilizer, are added, is the most reasonable surface roughness and etching rate. As result of solder test, it is estimated that solder resist ink did not peel away or curl up and have reliable adhesiveness.
Keywords:soft etching;inhibitor;surfactant;solder resist ink;peel strength
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