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Journal of the Electrochemical Society, Vol.155, No.3, D196-D202, 2008
Electroless plating of silicon nitride using (3-aminopropyl) triethoxysilane
In this work we demonstrate electroless Cu and Ni-P (using both alkaline and acidic solutions) metallization of a silicon nitride surface. This was done by surface pretreatment with NH2 functionalization via silanization, followed by adsorption of Pd/Sn nanoparticles onto the surface. Using this method, films of Ni-P and Cu were created and characterized. As a possible application we demonstrate metallization of atomic force microscope probes by Ni-P and Au (on top of the Ni-P from the acidic solution). (C) 2008 The Electrochemical Society.