Electron beam induced deposition (EBID) is of interest as a damage-free and resist-less means of incorporating nonconventional materials such as polymer fibers, nanowires, and carbon nanotubes into integrated circuits. A novel inorganic platinum precursor-Pt(PF3)(4)-is investigated in this work, as it has previously been demonstrated to deposit Pt with resistivities close to bulk Pt when deposited using high dose rates. In this work, the effects of 100 and 200 degrees C anneals on these Pt deposits are examined. Annealing these deposits is observed to shrink the deposits and decrease their P content. As a result, the measured Pt resistivities decreased with annealing by factors of 1.6-9.9. (c) 2007 American Vacuum Society.