Ultra-high-resolution lithography resists based on calix[4]resorcinarene derivatives are shown to be compatible with supercritical CO2 processing upon the incorporation of specific functionalities, as illustrated by the inset to the figure. The compounds show high glass-transition temperatures, excellent solubility in supercritical CO2, and good film forming properties, enabling the patterning of line/space features as small as 70 nm (depicted in the figure).