Two novel bismaleimide (BMI) monomers containing silicon atom in the structure, i.e., bis[4-(4-maleimidophenylcarbonyloxy)phenyl]dimethylsilane (BMI-SiE1) and bis [4-(4-maleimidophenyloxycarbonyl)phenyl]dimethylsilane (BMI-SiE2), were designed, synthesized, and polymerized with and without the use of diamine as comonomers to yield novel silicon-containing BMI resins. Both monomers obtained are readily soluble in organic solvents, such as chloroform and N, N-dimethylformamide. Differential scanning calorimetry and thermogravimetric analysis investigation of these two monomers indicated a high polymerization temperature (T-p > 240 degrees C) and a good thermal and thermo-oxidative stability of cured BMI resins. The onset temperature for 5% weight loss was found to be above 450 degrees C in nitrogen and above 400 degrees C in the air. Polymerization of BMI-SiE1 and BMI-SiE2 with 4,4'-diaminodiphenylether (DPE) yielded a series of polyaspartimides that had good solubility and could be thermally cured at 250 degrees C. TGA investigations of the cured diamine-modified BMI resins showed onset of degradation temperatures (T(d)s) in the range of 344-360 degrees C in nitrogen and 332-360 degrees C in the air. Composites based on the cured diamine-modified BMI resins and glass cloth were prepared and characterized for their dynamic mechanical properties. All the composites showed high glass transition temperatures (e.g., >190 degrees C) and high bending modulus in the range of 1000-2700 MPa. (C) 2008 Wiley Periodicals, Inc.