We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 mu m. This process can be applied to the nano or micro bonding of various transparent systems such as. at panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics. (C) 2008 Elsevier B. V. All rights reserved.