Applied Surface Science, Vol.255, No.4, 1357-1359, 2008
The optimization of incident angles of low-energy oxygen ion beams for increasing sputtering rate on silicon samples
In order to determine an appropriate incident angle of low-energy (350-eV) oxygen ion beam for achieving the highest sputtering rate without degradation of depth resolution in SIMS analysis, a delta-doped sample was analyzed with incident angles from 0 degrees to 60 degrees without oxygen bleeding. As a result, 45 degrees incidence was found to be the best analytical condition, and it was confirmed that surface roughness did not occur on the sputtered surface at 100-nm depth by using AFM. By applying the optimized incident angle, sputtering rate becomes more than twice as high as that of the normal incident condition. (C) 2008 Elsevier B.V. All rights reserved.
Keywords:Low energy oxygen ion beam;Incident angle;Sputtering rate;Delta-doped silicon sample;Surface roughness;Atomic force microscopy