For increasing the packing density of electronic devices and enabling 3D wiring, new concepts of interconnection for flexible circuit boards are required. The backside wiring is one innovative concept which, however, requires interconnections from the back to the front side by means of vias. Results on backside opening of polymer foils for exposing a thin metal film deposited at the front side are presented. For the experiments, a thin polyimide foil covered with a thin molybdenum metal film was used. By using mask projection of a pulsed UV-laser beam (248 nm, 20 ns) polymer foil was ablated. The laser ablation process must be adjusted in the manner to avoid damage of the thin metal film, to prevent cones formation at laser ablation, but still enabling the clean ablation of the polymer. The influence of process parameters on the backside opening is discussed and compared with theoretical estimations of the laser-induced temperatures. Using a two-step ablation process applying first high fluences to ablate the main part of the foil and finishing with low laser fluence turns out to be advantageous. This backside opening (BSO) can be used to perform an electrical contact from the backside. (C) 2009 Elsevier B. V. All rights reserved.