An overview of microelectronic processing is given. The processing consists of three parts: raw material processing leading to wafer from sand, device fabrication(e.g., intergrated circuit) on the wafer, and packaging of the fabricated integrated circuit. Some detailed processing steps for each part are given along with approaches that should be taken for the overall processing. The material presented here is intended to give an overview of the processing so that readers can have a picture and a grasp of what the processing is and what it involves.