A microspherical Cu-Sn alloy was electrodeposited on porous Cu substrate that was fabricated by electrodeposition with hydrogen bubbles as dynamic template and served ultimately as a current collector. The Cu-Sn alloy was determined by X-ray diffraction as an intermetallic composite of Cu6Sn5. Scanning electron microscope images illustrated that the Cu6Sn5 alloy consists in sphere-shaped particles growing on toothed branches of the porous Cu substrate. A galvanostatic charging/discharging test indicated that the microspherical Cu6Sn5 alloy on porous Cu substrate exhibited high first-discharge and -charge capacity, which were determined to be 563 and 493 mAh g(-1), respectively. It has also revealed that the as-prepared electrode displayed a good retention of capacity, and the discharge and charge capacities at the 20th cycle were measured as high as 445 and 407 mAh g(-1). (C) 2008 The Electrochemical Society.