Copper films electrodeposited from acid sulfate baths containing conventional additives used in the damascene process for the fabrication of ultralarge-scale integration interconnects were analyzed quantitatively to investigate the relation between carbon content and electrical resistivity of the deposit. In the as-deposited state, the resistivity of deposits that did not exhibit self-annealing effects in scanning ion microscope examination increased almost linearly with carbon content in the range of 0.002-0.045 wt %. The deposits that exhibited self-annealing effects showed higher resistivity values at identical carbon contents. After self-annealing, resistivity values of all deposits varied almost linearly with carbon content. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3054273] All rights reserved.