This article presents an on-wafer implementable test method for a surface-energy characterization of full-wafer bonds. The test is based on a modification of the common destructive blister test where, in addition, a "sacrificial bond" is implemented. During the test, an internal crack is generated at the "sacrificial bond" only. An analytical model was set up and numerical simulations were carried out to enhance the model for small structures with large thickness-to-length ratios. The test handling was automated to be used within bulk fabrication. Finally, different samples were characterized and the result was compared to the established double cantilever beam-test method.