BY using a two-step synthetic method, a novel grinding material, SiC and polyimide grinding slice, is prepared. This grinding slice can be used for mechanical planarization of hard and brittle materials, such as silicon, optical glass, advanced ceramics, specials metal, jewelry, disks etc. For observing the physical and chemical properties of the slice, scanning electron microscopy, FTIR spectroscopy, thermal gravimetric analysis, tensile strength, and elongation at break are used. All the experimental data indicate that the SiC/PI slice will be a very useful grinding material for obtaining a precision Surface. (C) 2009 Wiley Periodicals, Inc. J Appl Polym Sci 113: 3033-3037, 2009