Journal of Vacuum Science & Technology B, Vol.26, No.6, 2534-2538, 2008
Microscale self-assembly using molten alloys with different melting points
The authors demonstrate a system for self-assembling 280 mu m sized parts onto a separate template using two molten alloys having differing melting points. The use of two alloys decoupled the formation of mechanical and electrical connections and improved the resulting electrical contact resistance by over two orders of magnitude.
Keywords:bismuth alloys;contact resistance;electrical contacts;integrated circuit interconnections;integrated circuit packaging;lead alloys;liquid metals;melting point;reflow soldering;self-assembly;tin alloys