The authors evaluated the performance of the negative-tone resist ma-n 1405 for lift-off and hybrid processes by combining electron-beam and/or laser lithography techniques with metal deposition. Electron lithography and gold deposition allow the fabrication of useful structures such as circles, lines, and coaxes with a resolution of nearly 70 nm. The ability of this resist to withstand a hybrid process was also tested. A constricted line was transferred to the silicon substrate by lift-off, where the large (1 mu m linewidth) and the small (200 nm linewidth) features were, respectively, patterned by laser and electron-beam direct writing on a single resist level. (C) 2009 American Vacuum Society. [DOI: 10.1116/1.3039689]